Contract Manufacturing Services for Electronic Assemblies
Over 25 years design experience in Electronic Engineering
Manufacturing
Our modern production line is capable of assembling sophisticated protoypes to medium volume boards with a high-mix of component technologies.
We manufacture in an anti-static ESD-environment according to DIN EN 61340-5-1
We are certified according to Quality Managment System DIN ISO 9001:2015
We will provide you with an unlimited amount of over 700 different components (PDF, 47 KB), free of charge with every Prototype Assembly order. Take up this offer and save time and money with component purchasing. It really is an incredible offer!
Please click on the headings below for more information.
Surface-Mount-Device (SMD) Assembly|
Board quantities from 1-piece to medium-volume batch sizes Single-sided, mixed (SMD/THD) and double-sided SMD-Assembly Components from 0201, QFP 0,4mm, 50mm x 50mm and special sizes Quality assurance through optical inspection systems
Our SMD-production line consists of: Stencil holder Quattro-Flex II (from LTC) Fully automatic Stencil Printer BS1400 (from Autotronik) Automatic SMD Pick-and-Place System BS384V (from Autotronik) Full convection Reflow Oven RO300FC (from Essemtec) Optical Assembly Inspection System Quins-Easy (from Quins) Optical SMD-, BGA Inspection System Ersascope (from Ersa) |
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| WEEng SMD production process design rules (on request) |
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Board quantities from 1-piece to medium-volume batch sizes Mixed THD- and SMD Assembly Hand assembly and manual-/automatic Soldering
Our THD-production line consists of: Several component cut-and-bend machines (from Variocut, Loupot) Several half-automatic THD Pick-and-Place Laser tables (from Heeb) Dual-wave Soldering machine ATF 13/25 (from ATF) |
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Internal Production Documents:
| WEEng THD production process design rules (on request) |
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No minimum board quantity Rework and repair of falsely assembled boards Recovery of components on assembled boards (BGAs, QFNs, etc.) Professional Rework System IR-XT5P (from PDR) Multi-Digital Repair Station WMD 1S (from Weller) Digital Dispenser DX-200 (from OKI) |
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Assembly Repair
A well known problem encountered by hardware design engineers during tests and measurements of their new prototype boards is when a fine-pitch/lead-less device needs replacing. Standard lab soldering/de-soldering tools are often not suitable for such a task. In order to achieve a reliable, cost-effective and top-quality replacement, we offer our services using the professional rework system IR-XT5P.
Recovery and Recycling of SMD-Components
We also offer you the possibility of recovering and recycling expensive and hard-to-buy SMD-components (ie. ASICs, FPGAs, Micrcontrollers, BGAs, Connectors, Inductors, etc.) from your old assembled boards. The recycled parts are then ready to be used for your next series of boards.
Material Procurement
EMS Dictionary
We can procure all the necessary components for a particular board assembly. Our dedicated purchasing department can source parts worldwide and take advantage of bulk purchasing to secure competitive market prices. For some of the more common SMD components, we actually prefer to supply these ourselves in order to reduce the amount of maschine change-over (feeders) time. We pass the corresponding savings directly on to you.
Lead-times, component obsolescene, counterfeit parts, etc. are just some of the issues that accompany products throughout their life-cycle. Our complete team is directly at hand to solve these problems.
Product Assembly and Test
In addition to board assembly we also offer final product assembly, ranging from microcontroller-, CPLD- and FPGA programming; to fitting the assembled board into an enclosure comprising of multiple cables, plus final testing and shipping. Our service extends to repairing and upgrading products after they have been shipped. Our flexible approach means we will review your requirements with you and provide a tailored solution in a cost effective manner.
| 0201 | Refers to the size, in inches, of a SMD component (mainly resistors and capacitors). ie. "02" = 0.02 inches. The metric size is approx. 0.6mm x 0.3mm. |
| 0402 | Refers to the size, in inches, of a SMD component (mainly resistors and capacitors). ie. "04" = 0.04 inches. The metric size is approx. 1.0mm x 0.5mm. |
| 0603 | Refers to the size, in inches, of a SMD component (mainly resistors and capacitors). ie. "06" = 0.06 inches. The metric size is approx. 1.6mm x 0.8mm. |
| 0805 | Refers to the size, in inches, of a SMD component (mainly resistors and capacitors). ie. "08" = 0.08 inches. The metric size is approx. 2.0mm x 1.25mm. |
| 1206 | Refers to the size, in inches, of a SMD component (mainly resistors and capacitors). ie. "12" = 0.12 inches. The metric size is approx. 3.2mm x 1.6mm. |
| AOI | Automated Optical Inspection. A process designed to detect manufacturing defects in printed circuit assemblies through automated optical inspection techniques. |
| AXI | Automated X-ray Inspection. A process designed to detect manufacturing defects in printed circuit assemblies through automated x-ray inspection techniques. |
| BGA | Ball Grid Array. Refers to the array of solder balls on the underside of a SMD component (semiconductor). Spacing between balls is typically 1.27mm. The use of BGAs allows for higher density designs. Due to ever increasing complexity newer devices are available with smaller ball spacing of 0,8mm and 0,5mm (LFBGA and TFBGA). |
| EMS | Electronic Manufacuturing Services. Also known as "contract manufacturing services (CMS)". A CMS company manufactures electronic products for other companies on a contract basis, including printed circuit boards, electronic assemblies and complete systems. It may also offer electronic design services as well. |
| MELF | Metal Electrode Leadless Face. Commonly called "0207". Round barrel-like shape. Refers to the size of a SMD component (mainly resistors and diodes). The metric size is approx. 5.8mm length, 2.2mm diameter. |
| Mini MELF | Metal Electrode Leadless Face. Commonly called "0204". Round barrel-like shape. Refers to the size of a SMD component (mainly resistors and diodes). The metric size is approx. 3.6mm length, 1.4mm diameter. |
| Micro MELF | Metal Electrode Leadless Face. Round barrel-like shape. Refers to the size of a SMD component (mainly resistors and diodes). The metric size is approx. 2.2mm length, 1.1mm diameter. |
| PCB | Printed Circuit Board. A PCB electrically connects components using conductive (mainly copper) tracks (traces), on a non-conductive material. There are several materials (substrates) available depending upon costs and intended environment. Typically "FR-4'" is used. A PCB may consist of several "layers" (ie. single-, double-, 4-layer, 16-layer) depending on the PCB size and complexity (component density). Components are "soldered" on the top and/or bottom side. The PCB also plays a key role concerning EMC (electro-magnetic compatibility). |
| QFN | Quad Flat No-lead. Refers to a semiconductor package with pads instead of pins. The pads are located on the underside of the SMD component. Typical pad spacings are 0.5mm or 0.65mm. Very new devices may have a pitch of 0.4mm (UQFN). |
| QFP | Quad Flat Package. Refers to a semiconductor package with pins on all four sides. Typical pin spacing (pitch) are 0.5mm or 0,65mm. |
| Rework | The process of replacing a defective SMD component. Not all components can be replaced using simple tools like a soldering-iron. More complex components (ie. QFN devices) require a tool specifically designed for such a purpose (ie. rework system using hot-air/infra-red technology). WEEng is able to offer a professional SMD rework service using an infra-red system IR-XT5P. |
| Rigid-Flex | Refers to a type of construction that connects several "normal" (rigid) PCBs together using a flexible (flex) ribbon. The flexible ribbon consists of conductive tracks (traces) that electrically connect each PCB. |